Product ID Nearby Chip Rubber Cementing Agent - Edgebond-EZBOND CHEMICAL CO.,LTD _

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Product ID Nearby Chip Rubber Cementing Agent - Edgebond

MOQ ： piece

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Product details

Supply Ability

Supply Ability： piecesWarranty(Year)：1 Year

Packaging & Delivery

Packaging： piece

Product Specifications

Product Description

Edgebond

The Edgebond usually fix the BGA / CSP chip in 4 corner to achieve the adhesive. It does not like the Underfill need to seep completely to the flip chip base to achieve the completely fixed. Works with the Edgebond does not need preheating nor putting into over for the Underfill to seep completely to the flip chip, this reduced the working-hour and the gel quantity. It may rework, therefore the cost is also low.

Specifications:

Applies in:
- Slim & Light notebook.
- Vehicle electron.

X19331	Reworkable Edgebond Adhesive
TYPICAL PROPERTIES	-
Color	Translucent White
Viscosity (cps) SSA#14,1RPM,25°C	300,000
Cure Conditions, minutes	-
110°C	30
120°C	5
150°C	1
Specific Gravity	1.16
Shelf Life@ -5°C, months	6
Pot Life@ 25°C, days	14
CURED PROPERTIES ( 150℃/1MINUTE )	-
CTE, ppm/°C	70
Tg, °C	70
Shear Storage Modulus, GPa	1.1
Volatiles Content, wt% loss on cure	<2.0