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Product ID Nearby Chip Rubber Cementing Agent - Edgebond

MOQ : piece

Lead Time : Days

Seller Support : Trade Authenticity Guaranteed & Accepting

Payment : L/C,T/T,Western Union, Money Gram, Credit Card, Paypal

Product details

Supply Ability

  • Supply Ability: piecesWarranty(Year):1 Year

Packaging & Delivery

  • Packaging: piece

Product Specifications

Product Description

Edgebond


The Edgebond usually fix the BGA / CSP chip in 4 corner to achieve the adhesive. It does not like the Underfill need to seep completely to the flip chip base to achieve the completely fixed. Works with the Edgebond does not need preheating nor putting into over for the Underfill to seep completely to the flip chip, this reduced the working-hour and the gel quantity. It may rework, therefore the cost is also low.

Specifications:
  • Applies in:
    • Slim & Light notebook.
    • Vehicle electron.


    X19331Reworkable Edgebond Adhesive
    TYPICAL PROPERTIES-
    ColorTranslucent White
    Viscosity (cps) SSA#14,1RPM,25°C300,000
    Cure Conditions, minutes-
    110°C30
    120°C5
    150°C1
    Specific Gravity1.16
    Shelf Life@ -5°C, months6
    Pot Life@ 25°C, days14
    CURED PROPERTIES ( 150℃/1MINUTE )-
    CTE, ppm/°C70
    Tg, °C70
    Shear Storage Modulus, GPa1.1
    Volatiles Content, wt% loss on cure<2.0

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